832TC-450ML

832TC potting and encapsulating compound is a thermally conductive, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management is a concern. Due to its high thermal conductivity, it protects circuits, by reducing the risk of heat build-up. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus and many harsh chemicals. This epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment. 832TC can be cured at room temperature or higher.

• Thermal conductivity of 0.68W/(m•K)
• Low exotherm
• Convenient 1A:1B volume mix ratio
• High compressive and tensile strength
• Excellent adhesion to substrates including metals, composites, glass, ceramics and plastics
• Excellent electrical insulating characteristics
• Extreme resistance to water and humidity (allows for submersion where needed)
• Solvent-free