4860-18G

4860-18G is a solder wire. It has electronic grade and use the eutectic tin-to-lead alloy ratio, with a no-clean, synthetically refined, splatter-proof, resin flux core. It is the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation. It achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

• 21 gauge, 0.032inch diameter
• Eutectic alloy (liquidus=solidus temperature), alloy exceeds J-STD-006C and meets ASTM
• Flux meets J-STD-004B, spreads like rosin-activated flux, virtually non-splattering
• Non-corrosive and non-conductive residue, REL0 flux classification
• Resin flux type, low flux activity, no removal copper mirror
• Corrosion test, electromigration, silver chromate–Cl– + Br–, flux residue dryness
• Softening point of flux extract is 24°C, splitting of flux–cored wire solder is 0.30%
• Post reflow flux residue is 55%, surface insulation resistance is 2.3 x 10¹¹ ohm
• Pocket package