130-C
Compression Spring, Semiconductors to 2.25" (57.2mm) Diameter, 95.3 mm
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| Quantidade | Preço |
|---|---|
| 1+ | $ 158.860 |
| 5+ | $ 153.530 |
| 10+ | $ 148.210 |
| 25+ | $ 138.440 |
| 50+ | $ 133.120 |
| 100+ | $ 130.460 |
| 250+ | $ 120.700 |
Informação do produto
Descrição geral do produto
The 130-C is a Compression Mounting Clamp Assembly for semiconductors to 2.25-inch (57.2mm) diameter. The 130 series clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and heat dissipation for high-power compression pack semiconductor. The high-quality mounting clamp assemblies are the worldwide standard for mounting, compression and clamping press-pack SCR, thyristor, rectifier and other high power disc packaged devices utilized in power distribution equipment, industrial controls, transportation systems and power supply and conversion systems.
- Crossbar device mounting
- Surface to spring assembly
- 800 to 2000lbs (362.9 to 907.2kg) Maximum clamping force
Aplicações
Thermal Management, Industrial
Especificações Técnicas
Compression Mounting Clamp
95.3mm
-
Semiconductors to 2.25" (57.2mm) Diameter
22.4mm
No SVHC (21-Jan-2025)
Legislação e Ambiente
RoHS
RoHS
Certificado de conformidade do produto