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MT53E1G32D2FW-046 AAT:B
DRAM, Mobile LPDDR4, 32 Gbit, 1G x 32bit, 2.133 GHz, TFBGA, 200 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT53E1G32D2FW-046 AAT:B
Newark Part No.80AJ9993
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| Quantity | Price |
|---|---|
| 1+ | $280.650 |
Price for:Each
Minimum: 1
Multiple: 1
$280.65
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E1G32D2FW-046 AAT:B
Newark Part No.80AJ9993
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density32Gbit
DRAM Density32Gbit
DRAM Memory Configuration1G x 32bit
Memory Configuration1G x 32bit
Clock Frequency Max2.133GHz
Clock Frequency2.133GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
Access Time468ps
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max105°C
Product Range-
SVHCNo SVHC (08-Jul-2021)
Product Overview
MT53E1G32D2FW-046 AAT:B is a x32 automotive mobile LPDDR4 SDRAM high-speed, CMOS dynamic random-access memory device.
- 1G x 32bit memory configuration, 4266Mb/s data rate/pin, 468ps tCK RL= 36/40 cycle time
- 1.10V VDD2 / 0.60V VDDQ or 1.10V VDDQ/1.80V VDD1 operating voltage
- AEC-Q100 automotive grade
- Frequency range from 2133 to 10MHz, 2133MHz clock rate, 16n prefetch DDR architecture
- 8 internal banks per channel for concurrent operation, single-data-rate CMD/ADR entry
- Bidirectional/differential data strobe per byte lane, programmable READ and WRITE latencies (RL/WL)
- On-chip temperature sensor to control self refresh rate
- On-chip temperature sensor to control self refresh rate, Selectable output drive strength (DS)
- Partial-array self refresh (PASR), programmable VSS (ODT) termination, single-ended CK, DQS support
- Operating temperature range from -40 to +105°C, 200-ball TFBGA 10 x 14.5 x 1.1mm (Ø0.40 SMD) package
Technical Specifications
DRAM Type
Mobile LPDDR4
DRAM Density
32Gbit
Memory Configuration
1G x 32bit
Clock Frequency
2.133GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
IC Mounting
Surface Mount
Operating Temperature Max
105°C
MSL
MSL 3 - 168 hours
Memory Density
32Gbit
DRAM Memory Configuration
1G x 32bit
Clock Frequency Max
2.133GHz
Memory Case Style
TFBGA
No. of Pins
200Pins
Access Time
468ps
Operating Temperature Min
-40°C
Product Range
-
SVHC
No SVHC (08-Jul-2021)
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (08-Jul-2021)
Download Product Compliance Certificate
Product Compliance Certificate