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ManufacturerMICRON
Manufacturer Part NoMT46H16M32LFB5-5 IT:C
Newark Part No.83AH2732
Your Part Number
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 17 week(s)
| Quantity | Price |
|---|---|
| 1+ | $8.210 |
Price for:Each
Minimum: 1440
Multiple: 1440
$11,822.40
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT46H16M32LFB5-5 IT:C
Newark Part No.83AH2732
Technical Datasheet
DRAM TypeMobile LPDDR
DRAM Density512Mbit
Memory Density512Mbit
Memory Configuration16M x 32bit
DRAM Memory Configuration16M x 32bit
Clock Frequency Max200MHz
Clock Frequency200MHz
IC Case / PackageVFBGA
Memory Case StyleVFBGA
No. of Pins90Pins
Supply Voltage Nom1.8V
Access Time5ns
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT46H16M32LFB5-5 IT:C is a mobile LPDDR SDRAM. The 512Mb mobile low-power DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. It is internally configured as a quad-bank DRAM. Each of the x16’s 134,217,728-bit banks are organized as 8192 rows by 1024 columns by 16 bits. Each of the x32’s 134,217,728-bit banks are organized as 8192 rows by 512 columns by 32 bits.
- 1.8/1.8V operating voltage, differential clock inputs (CK and CK#)
- Bidirectional data strobe per byte of data (DQS)
- Internal, pipelined double data rate (DDR) architecture; two data accesses per clock cycle
- Commands entered on each positive CK edge, clock stop capability
- DQS edge-aligned with data for READs; center aligned with data for WRITEs
- 4 internal banks for concurrent operation, data masks (DM) for masking write data; one mask per byte
- Programmable burst lengths (BL): 2, 4, 8, or 16, concurrent auto precharge option is supported
- Auto refresh and self refresh modes, 1.8V LVCMOS-compatible inputs
- 200MHz clock rate, 5.0ns access time, 16 Meg x 32 configuration, JEDEC-standard addressing
- 90-ball VFBGA package, -40°C to +85°C industrial operating temperature range
Technical Specifications
DRAM Type
Mobile LPDDR
Memory Density
512Mbit
DRAM Memory Configuration
16M x 32bit
Clock Frequency
200MHz
Memory Case Style
VFBGA
Supply Voltage Nom
1.8V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
512Mbit
Memory Configuration
16M x 32bit
Clock Frequency Max
200MHz
IC Case / Package
VFBGA
No. of Pins
90Pins
Access Time
5ns
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate