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SMDLTLFP
Solder Paste, No Clean, 42, 57.6, 0.4 Sn, Bi, Ag, 138 °C, 15 g, CHIPQUIK Series
Image is for illustrative purposes only. Please refer to product description.
ManufacturerCHIP QUIK
Manufacturer Part NoSMDLTLFPCopy
Manufacturer Standard Lead Time6 weeks
Newark Part No.18AM7641
Your Part Number
Available to Order
Manufacturer Standard Lead Time: 6 week(s)
Notify me when back in stock
| Quantity | Price |
|---|---|
| 1+ | $15.950 |
Price for:Each
Minimum: 1
Multiple: 1
$15.95
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
Product Overview
No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip.
- Low melting point allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Alloy: Sn42/Bi57.6/Ag0.4
- Melting point: 138°C
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
Technical Specifications
Flux Type
No Clean
Melting Temperature
138°C
Weight - Imperial
0.52oz
SVHC
No SVHC (17-Dec-2015)
Solder Alloy
42, 57.6, 0.4 Sn, Bi, Ag
Weight - Metric
15g
Product Range
-
Technical Docs (2)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate