Low

1978-DP - 

HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ

TECHSPRAY 1978-DP

The actual product may differ from image shown

Manufacturer:
TECHSPRAY TECHSPRAY
Manufacturer Part No:
1978-DP
Newark Part No.:
68K7301
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
-
:
4oz
:
-
:
Tube
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Product Overview

The 1978-DP is a Silicone-free Heat Sink draws heat away when applied to a component. In electronics heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical application, it is used with thermocouple wells, thermistors and calrods or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solder ability and increase solder defects. It is in the form of gray paste.
  • Thermal conductivity 0.92W/mK
  • -40 to 392°F Functional temperature range
  • Non-ozone depletion
  • Avoids solder defects due to silicon contamination
  • Will not separate
  • Will not harden and crack
  • 296°C Flash point
  • >204°C Boiling point

Applications

Consumer Electronics, Maintenance & Repair

Associated Products