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1978-DP - 

HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ

TECHSPRAY 1978-DP

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Manufacturer:
TECHSPRAY TECHSPRAY
Manufacturer Part No:
1978-DP
Newark Part No.:
68K7301
Technical Datasheet:
(EN)
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Product Information

:
Tube
:
-
:
4oz
:
-
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Product Overview

The 1978-DP is a Silicone-free Heat Sink draws heat away when applied to a component. In electronics heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical application, it is used with thermocouple wells, thermistors and calrods or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solder ability and increase solder defects. It is in the form of gray paste.
  • Thermal conductivity 0.92W/mK
  • -40 to 392°F Functional temperature range
  • Non-ozone depletion
  • Avoids solder defects due to silicon contamination
  • Will not separate
  • Will not harden and crack
  • 296°C Flash point
  • >204°C Boiling point

Applications

Consumer Electronics, Maintenance & Repair

Associated Products

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Details: 
Hello Support,

Thermal conductivity for GC 10-8120, Heat sink compound.
What is the thermal conductivity in CAL/SEC CM degC?
I need to compare this product with another to use it in Production.

Regards,

Richard
1 year, 6 months ago
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Anonymous
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Answers

A: 
Per the Newark spec sheet, the answer given for the thermal conductivity is from the spec sheet but the units are in deg kelvin, not deg centigrade. I need the equivelent spec in deg centigrade. Need thermal conductivity for GC 10-8120 in the units of CAL/SEC CM deg C, and not CAL/SEC CM deg K.

Thanks -
1 year, 6 months ago
by
RichardCBD
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A: 
Thermal conductivity for part # 10-8120:
Property : Thermal Conductivity, g-cal/sec/cm2/°C/cm
Test Method : Modified D.S.C.
Condition : 36°C @ 1 sec
Result :1.8 X 10^-3
1 year, 6 months ago
by
TechGTC
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