63-0000-0979

The 63-0000-0979 is a VOC-free no-clean Flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. This flux finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. It also reduces micro solder balling on glossy laminates and between connector pins. It will not attack properly cured solder masks or FR-4 epoxy-glass laminate. It leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to be removed. It is in the form of colorless liquid with mild odor.

• 100°C Boiling point
• 1.02g/cm³ Density
• 23hPa Vapor pressure

Applications

Industrial, Consumer Electronics