FISCHER ELEKTRONIK  ICK BGA 23X23  Heat Sink, For Ball Grid Array, BGA, PLCC, 22.5 °C/W, 6 mm, 23 mm, 23 mm

FISCHER ELEKTRONIK ICK BGA 23X23

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Product Overview


The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
  • 1.8mm Plate thickness

Applications

Industrial
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Product Specifications, Documents & More


  • External Diameter - Imperial: -
  • External Diameter - Metric: -
  • External Height - Imperial: 0.24"
  • External Height - Metric: 6mm
  • External Length - Imperial: 0.91"
  • External Length - Metric: 23mm
  • External Width - Imperial: 0.91"
  • External Width - Metric: 23mm
  • Heat Sink Material: Aluminium
  • Packages Cooled: BGA, PLCC
  • SVHC: To Be Advised
  • Thermal Resistance: 22.5°C/W

Availability

Availability:  67


  • 67 in stock for same day shipping
 
Check stock and lead times
    More stock available week commencing 4/4/16

Price for: Each 1

Minimum order quantity: 1

Order multiple quantity: 1

Price: $1.71 $1.71

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Price

Quantity List Price
1 - 99 $1.71
100 - 249 $1.54
250 - 499 $1.39
500 - 999 $1.26
1000+ $1.16
 
 
Low

Legislation and Environmental


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