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ICK BGA 23X23 - 

Heat Sink, For Ball Grid Array, BGA, PLCC, 22.5 °C/W, 6 mm, 23 mm, 23 mm

ICK BGA 23X23 - Heat Sink, For Ball Grid Array, BGA, PLCC, 22.5 °C/W, 6 mm, 23 mm, 23 mm

The actual product may differ from image shown

Manufacturer Part No:
ICK BGA 23X23
Newark Part No.:
58M7230
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA, PLCC
:
22.5°C/W
:
6mm
:
23mm
:
23mm
:
-
:
Aluminium
:
0.24"
:
0.91"
:
0.91"
:
-
:
-
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Product Overview

The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
  • 1.8mm Plate thickness

Applications

Industrial

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83 In stock

UK Stock

Freight Charge: $20.00 once per order

Delivery in 5-7 days from our UK warehouse for in stock items

 
Check stock and lead times
More stock available week commencing 11/20/17
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