FISCHER ELEKTRONIK  ICK BGA 23X23  Heat Sink, For Ball Grid Array, BGA, PLCC, 22.5 °C/W, 6 mm, 23 mm, 23 mm

FISCHER ELEKTRONIK ICK BGA 23X23

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Product Overview


The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
  • 1.8mm Plate thickness

Applications

Industrial
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Product Information


  • Packages Cooled BGA, PLCC
  • SVHC To Be Advised
  • Thermal Resistance 22.5°C/W
  • External Height - Metric 6mm
  • External Width - Metric 23mm
  • External Length - Metric 23mm
  • External Diameter - Metric -
  • Heat Sink Material Aluminium
  • External Height - Imperial 0.24"
  • External Width - Imperial 0.91"
  • External Length - Imperial 0.91"
  • External Diameter - Imperial -
  • Product Range -

Availability

Availability:  92


  • 92 in stock for same day shipping
 
Check stock and lead times
    More stock available week commencing 6/27/16

Price for: Each

Minimum order quantity: 1

Order multiple quantity: 1

Price: $1.87 $1.87

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Price

Quantity List Price
1 - 99 $1.87
100 - 249 $1.69
250 - 499 $1.53
500 - 999 $1.38
1000+ $1.27
 
 
Low

Legislation and Environmental


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