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FISCHER ELEKTRONIK  ICK BGA 23X23  Heat Sink, For Ball Grid Array, BGA, PLCC, 22.5 °C/W, 6 mm, 23 mm, 23 mm

FISCHER ELEKTRONIK ICK BGA 23X23
Technical Data Sheet (34.35KB) EN See all Technical Docs

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Product Overview

The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
  • 1.8mm Plate thickness

 

Product Information

Packages Cooled:
BGA, PLCC
Thermal Resistance:
22.5°C/W
External Height - Metric:
6mm
External Width - Metric:
23mm
External Length - Metric:
23mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.24"
External Width - Imperial:
0.91"
External Length - Imperial:
0.91"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
To Be Advised

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Applications

  • Industrial

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Associated Products