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FISCHER ELEKTRONIK  ICK BGA 10 X 10 X 10  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28.5 °C/W, 10 mm, 10 mm, 10 mm

FISCHER ELEKTRONIK ICK BGA 10 X 10 X 10
Technical Data Sheet (412.89KB) EN See all Technical Docs

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Product Overview

The ICK BGA 10 X 10 X 10 is a 10mm Heat Sink with aluminium, black anodised, universal socket, pins, square, 28.5 to 8.1K/W thermal resistance. The heat sink features thermal conductive foil and adhesive fixation. Suitable for universal processor and IC design BGAs.
  • 1.9W Dissipation loss

 

Product Information

Packages Cooled:
BGA
Thermal Resistance:
28.5°C/W
External Height - Metric:
10mm
External Width - Metric:
10mm
External Length - Metric:
10mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.394"
External Width - Imperial:
0.394"
External Length - Imperial:
0.394"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
To Be Advised

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Applications

  • HVAC

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Associated Products