Low

ICK BGA 10 X 10 X 10 - 

Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28.5 °C/W, 10 mm, 10 mm, 10 mm

FISCHER ELEKTRONIK ICK BGA 10 X 10 X 10

The actual product may differ from image shown

Manufacturer Part No:
ICK BGA 10 X 10 X 10
Newark Part No.:
17T5892
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
10mm
:
BGA
:
0.394"
:
Aluminium
:
0.394"
:
0.394"
:
10mm
:
-
:
28.5°C/W
:
-
:
-
:
10mm
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Product Overview

The ICK BGA 10 X 10 X 10 is a 10mm Heat Sink with aluminium, black anodised, universal socket, pins, square, 28.5 to 8.1K/W thermal resistance. The heat sink features thermal conductive foil and adhesive fixation. Suitable for universal processor and IC design BGAs.
  • 1.9W Dissipation loss

Applications

HVAC

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