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BP100-0.005-00-12/12
Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "
Image is for illustrative purposes only. Please refer to product description.
ManufacturerBERGQUIST
Manufacturer Part NoBP100-0.005-00-12/12
Newark Part No.18K5357
Your Part Number
Technical Datasheet
123 In Stock
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Delivery in 2-4 Business Days(UK stock)
Order before 9pm EST standard shipping
| Quantity | Price |
|---|---|
| 1+ | $293.670 |
| 5+ | $283.640 |
| 10+ | $269.820 |
| 25+ | $255.960 |
| 50+ | $220.140 |
Price for:Each
Minimum: 1
Multiple: 1
$293.67
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Overview
- Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
- Thermal impedance: 0.86℃ - in²/W (@ 100 psi)
- High bond strength to a variety of surfaces
- Double-sided pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat cure adhesive, screw mounting or clip mounting
Technical Specifications
Thermal Conductivity
0.8W/m.K
Thickness
0.005"
Dielectric Strength
-
External Width
300mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
-
Thermal Impedance
-
External Length
-
Product Range
-
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (25-Jun-2025)
Download Product Compliance Certificate
Product Compliance Certificate