HDB-D4-080M022X

Amphenol’s HDB3 connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070” X .060” staggered grid pattern. Typically used in cable to board applications, crimp termination and uses wire well size 22D.

• HDB3 daughter board mates with motherboard
• High density (60, 80 and 120) brush contacts in a tight .070” X .060” staggered grid pattern
• High speed data rates up to 6.250Gb/s via 100 ohm matched impedance differential pairs
• 100K mating cycles vs. 2K for competitive connectors
• Low insertion/extraction force (1.5 ounce typical per contact)
• Resistant to shock, vibration & fretting corrosion
• Low cost for a high level of performance
• Uses less board space
• Allows for shorter mated height
• Provides the durability and performance of the brush contact