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OM13496UL
Breakout Board, 16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP/DIP, 0.1" Pitch Spacing
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 8 week(s)
| Quantity | Price |
|---|---|
| 1+ | $20.680 |
Price for:Each
Minimum: 1
Multiple: 1
$20.68
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerNXP
Manufacturer Part NoOM13496UL
Newark Part No.44AC0517
Technical Datasheet
Convert From16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP
Convert ToDIP
Pitch Spacing2.54mm
Row Pitch-
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
OM13496UL is a surface mount to DIP evaluation board. The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13496 supports the following packages such as QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I2C daughter cards
- Supported devices: PCA9635PW 16bit Fm+ I²C-Bus LED driver
Technical Specifications
Convert From
16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP
Pitch Spacing
2.54mm
Product Range
-
Convert To
DIP
Row Pitch
-
SVHC
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate