Print Page
OM13496UL
Breakout Board, 16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP/DIP, 0.1" Pitch Spacing
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 9 week(s)
| Quantity | Price |
|---|---|
| 1+ | $20.680 |
Price for:Each
Minimum: 1
Multiple: 1
$20.68
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
This number will be added to the Order Confirmation, Invoice, Dispatch note, Web confirmation Email and Product Label.
Product Information
ManufacturerNXP
Manufacturer Part NoOM13496UL
Newark Part No.44AC0517
Technical Datasheet
Convert From16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP
Convert ToDIP
Pitch Spacing2.54mm
Row Pitch-
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
OM13496UL is a surface mount to DIP evaluation board. The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13496 supports the following packages such as QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I2C daughter cards
- Supported devices: PCA9635PW 16bit Fm+ I²C-Bus LED driver
Technical Specifications
Convert From
16-XQFN, 16-XFBGA, 28-TSSOP, 16-QSOP
Pitch Spacing
2.54mm
Product Range
-
Convert To
DIP
Row Pitch
-
SVHC
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate