MC33662LEFR2

MC33662LEFR2 is an ISO 17987/LIN 2.x/SAEJ2602-2 LIN physical layer. The local interconnect network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a CAN. As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. This integrates a fast baud rate (above 100Kbps), as reported by the RXD pin for test and programming modes. This provides excellent EMC and Radiated Emission performance, ESD robustness, and safe behavior, in the event of a LIN bus short-to-ground, or a LIN bus leakage during low-power mode. This device is powered by SMARTMOS technology. The application includes body electronics (BCM, gateway, roof, door, lighting, HVAC), powertrain (EMS, start and stop), BMS, safety, and Chassis (TPMS, seat belt).

• 20kbps maximum baud rate
• Operational from a VSUP of 7 to 18VDC, functional up to 27VDC, and handles 40V during load dump
• Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 and ISO 17987-4:2016 (12V)
• Active bus wave shaping, offering excellent radiated emission performance
• Sustains up to 15KV min ESD IEC61000-4-2 on LIN Bus, 20kV on the WAKE pin, and 25kV on the VSUP pin
• Very high immunity against electromagnetic interference
• Low standby current in sleep mode, overtemperature protection
• Local and remote wake-up capability reported by the RXD pin
• Fast baud rate selection reported by RXD pin, pin-to-pin compatible with TJA1021
• 8 SOICN package, temperature range from -40 to 125°C