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ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2FW-046 AIT:B
Newark Part No.80AH8372
Your Part Number
Technical Datasheet
500 In Stock
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| Quantity | Price |
|---|---|
| 1+ | $20.060 |
| 5+ | $19.030 |
| 10+ | $17.980 |
| 25+ | $16.930 |
| 50+ | $15.790 |
| 100+ | $15.450 |
| 250+ | $14.950 |
Price for:Each
Minimum: 1
Multiple: 1
$20.06
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2FW-046 AIT:B
Newark Part No.80AH8372
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density8Gbit
DRAM Density8Gbit
DRAM Memory Configuration256M x 32bit
Memory Configuration256M x 32bit
Clock Frequency Max2.133GHz
Clock Frequency2.133GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
Access Time468ps
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT53E256M32D2FW-046 AIT:B is a 4Gb mobile low-power DDR4 SDRAM with low VDDQ. It is a high-speed CMOS, dynamic random-access memory. This memory is internally configured with x16 I/O, 8-banks. Each of the x16’s 536,870,912-bit banks are organized as 32,768 rows by 1024 columns by 16bits. It has directed per-bank refresh for concurrent bank operation and ease of command scheduling. This memory has on-chip temperature sensor to control self refresh rate. It has clock-stop capability.
- Operating voltage range is 1.10V (VDD2)/0.60V or 1.10V (VDDQ)
- 256Meg x 32 configuration, =LPDDR4, 2die addressing, B design
- Packaging style is 200-ball TFBGA
- Cycle time is 468ps at RL = 36/40, partial-array self refresh (PASR)
- Operating temperature range is –40°C to +95°C, automotive qualified
- Clock rate is 2133MHz, data rate per pin is 4266Mb/s
- Ultra-low-voltage core and I/O power supplies
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), selectable output drive strength (DS)
Technical Specifications
DRAM Type
Mobile LPDDR4
DRAM Density
8Gbit
Memory Configuration
256M x 32bit
Clock Frequency
2.133GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
8Gbit
DRAM Memory Configuration
256M x 32bit
Clock Frequency Max
2.133GHz
Memory Case Style
TFBGA
No. of Pins
200Pins
Access Time
468ps
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate