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ManufacturerMICRON
Manufacturer Part NoMT53D512M16D1DS-046 WT:D
Newark Part No.80AH8240
Your Part Number
Technical Datasheet
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| Quantity | Price |
|---|---|
| 1+ | $26.590 |
| 5+ | $25.630 |
| 10+ | $24.690 |
| 25+ | $23.840 |
| 50+ | $23.090 |
| 100+ | $22.650 |
| 250+ | $22.250 |
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Multiple: 1
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53D512M16D1DS-046 WT:D
Newark Part No.80AH8240
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density8Gbit
DRAM Density8Gbit
Memory Configuration512M x 16bit
DRAM Memory Configuration512M x 16bit
Clock Frequency2.133GHz
Clock Frequency Max2.133GHz
Memory Case StyleWFBGA
IC Case / PackageWFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Access Time-
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT53D512M16D1DS-046 WT:D is a mobile LPDDR4 SDRAM. The mobile low-power DDR4 SDRAM with low VDDQ (LPDDR4X) is a high-speed CMOS, dynamic random-access memory. The device is internally configured with x16 I/O, 8-banks. Each of the x16’s 1,073,741,824-bit banks are organized as 65,536 rows by 1024 columns by 16 bits. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2133MHz clock rate, 4266Mb/s/pin data rate
- 1.10V VDD2 / 0.60V VDDQ or 1.10V VDDQ ordering voltage
- 512 Meg x 32 configuration
- 200-ball WFBGA package, -25°C to +85°C operating temperature
Technical Specifications
DRAM Type
Mobile LPDDR4
DRAM Density
8Gbit
DRAM Memory Configuration
512M x 16bit
Clock Frequency Max
2.133GHz
IC Case / Package
WFBGA
Supply Voltage Nom
1.1V
Access Time
-
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
8Gbit
Memory Configuration
512M x 16bit
Clock Frequency
2.133GHz
Memory Case Style
WFBGA
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (2)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate