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| Quantity | Price |
|---|---|
| 1+ | $16.550 |
| 10+ | $15.810 |
| 25+ | $15.300 |
| 50+ | $14.520 |
| 100+ | $14.150 |
| 250+ | $13.690 |
| 500+ | $13.340 |
Product Information
Product Overview
MT41K512M8DA-093:P is a DDR3L SDRAM (1.35V). The double data rate architecture is an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR3 SDRAM effectively consists of a single 8n-bit-wide, four-clock cycle data transfer at the internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O pins. The differential data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the DDR3 SDRAM input receiver. DQS is center-aligned with data for WRITEs. The read data is transmitted by the DDR3 SDRAM and edge-aligned to the data strobes. The DDR3 SDRAM operates from a differential clock (CK and CK#).
- 512 Meg x 8 configuration, tCK = .983ns, CL = 14 speed grade, 2133MT/s data rate
- 14-14-14 target tRCD-tRP-CL, 13.09ns tRCD, 13.09ns tRP, 13.09ns CL, 8K refresh count
- 64K (A[15:0]) row address, 8 (BA[2:0]) bank address, 1K (A[9:0]) column address, 1KB page size
- VDD = VDDQ = 1.35V (1.283 to 1.45V), backward compatible to VDD = VDDQ = 1.5V ±0.075V
- Supports DDR3L devices to be backward compatible in 1.5V applications
- Differential bidirectional data strobe, 8n-bit prefetch architecture
- Differential clock inputs (CK, CK#), 8 internal banks
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS latency, programmable posted CAS additive latency, programmable CAS latency
- 78 ball FBGA package, commercial operating temperature range from 0 to 95°C
Technical Specifications
DDR3L
4Gbit
512M x 8bit
1.066GHz
TFBGA
1.35V
938ps
95°C
No SVHC (17-Jan-2023)
4Gbit
512M x 8bit
1.066GHz
TFBGA
78Pins
Surface Mount
0°C
-
Technical Docs (2)
Legislation and Environmental
RoHS
RoHS
Product Compliance Certificate