4875-227G

4875-227G is a Sn60/Pb40 no clean solder wire. This electronic grade solder wire use a tin-to-lead alloy ratio, with a no-clean, synthetically refined, splatter-proof resin flux core. This melt at a higher and wider temperature range than 63/37 solder. It creates robust and reliable joints that are highly resistant to whisker formation. This leaded solder achieves a consistent solder and flux percentage thanks to our state-of the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B for ROM1, particle size type 3
• Excellent 12mil fine pitch printing capability
• Long operational life non-slumping, good wettability
• Spool packaging, 21 gauge, 0.032inch diameter
• REL0 flux classification, resin flux type, low flux activity
• 100 acid number, 24°C softening point of flux extract, 130mm² solder spread
• 0.30% splitting of flux cored wire solder, <lt/>0.05% halides (by weight), 45% post reflow flux residue
• Store refrigerated between 18 to 25°C away from direct heat or sunlight