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Solder Paste, Tube, Temperature Stable, 200 °C


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Newark Part No.:
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Technical Documents (1)

Product Overview

The GC 10 TYPE 4 (SEMCO) is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallization including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints.
  • Excellent solderability and fast wetting to a variety of surface finishes
  • Halogen-free flux classification, ROL0 to ANSI/J-STD-004 Rev. B
  • Printing, down to 0.3mm pitch
  • Printing, up to 72 hours stencil life
  • Printing, up to 24 hours abandon time
  • Printing, suitable for high-speed printing up to 125 mms-1
  • Printing, improved paste-transfer efficiency
  • Reflow, enhanced soak process window 150-200°C (temperature and time)
  • Reflow, enhanced process window with superior coalescence and wetting
  • Reflow, minimal hot slump at 182°C
  • Reflow, superior coalescence and wetting on small components including 01005
  • Reflow, very shiny solder joints
  • Reflow, clear, colourless residues for easy post-reflow inspection
  • Reflow, residues print testable after 4x reflows


Maintenance & Repair, Industrial

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