HTC35SL

HTC35SL is a HTC non-silicone thermal interface material. This electrolube heat transfer compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. It should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicon rectifiers and semi-conductors, thermostats, power resistors and radiators. As with all thermal interface materials, it is always encourage stringent testing before selecting a material for your application.

• 35ml syringe
• Excellent non-creep characteristics
• Very high thermal conductivity of 0.9W/m.K
• Wide operating temperature range from -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity