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SMDLTLFP
Solder Paste, No Clean, 42, 57.6, 0.4 Sn, Bi, Ag, 138 °C, 15 g, CHIPQUIK Series
Image is for illustrative purposes only. Please refer to product description.
ManufacturerCHIP QUIK
Manufacturer Part NoSMDLTLFPCopy
Manufacturer Standard Lead Time6 weeks
Newark Part No.18AM7641
Your Part Number
1 In Stock
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| Quantity | Price |
|---|---|
| 1+ | $15.950 |
Price for:Each
Minimum: 1
Multiple: 1
$15.95
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Product Information
Product Overview
No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip.
- Low melting point allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Alloy: Sn42/Bi57.6/Ag0.4
- Melting point: 138°C
- Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)
Technical Specifications
Flux Type
No Clean
Melting Temperature
138°C
Weight - Imperial
0.52oz
SVHC
No SVHC (17-Dec-2015)
Solder Alloy
42, 57.6, 0.4 Sn, Bi, Ag
Weight - Metric
15g
Product Range
-
Technical Docs (2)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate