Module card subracks for 4.5" H (114.30mm) cards are factory assembled and designed for mounting modules, ordered separately.vMore Info
All bus and circuit patterns are solder coated. FR-4 epoxy glass and CEM-1 epoxy glass composite material with UL 94V-0 flame rating. Boards can be cut to smaller units.More Info
Pre-punched insulating punchboard is available in multiple grid patterns for assembling circuit components. Standard thickness is 1/16" (0.062").More Info
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