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RAWN  1307-01/10004  HEAT SINK COMPOUND

RAWN 1307-01/10004

Image is for illustrative purposes only. Please refer to product description.

Product Overview

The 1307-01/10004 is a Heat Sink Compound syringe used for heat transfer from semiconductor devices to mounting points, will not dry or harden. Ideal for electrical, electronics applications. It is in the form of opaque white colored grease and odorless.
  • 2.2 Specific gravity
  • >400°F Flash point

Applications

Industrial; Consumer Electronics

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Product Information

Sealant Type:
-
Sealant Applications:
Electrical, Electronics
Dispensing Method:
Syringe
Sealant Color:
White
Volume:
-
Weight:
10mg
Product Range:
-
For Use With:
Used for heat transfer from semiconductor devices to mounting points, will not dry or harden
SVHC:
To Be Advised

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Applications

  • Industrial;
  • Consumer Electronics

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