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MT62F3G32D8DV-023 WT:B
DRAM, LPDDR5, 96 Gbit, 3G x 32bit, 4.266 GHz, FBGA, 315 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT62F3G32D8DV-023 WT:B
Newark Part No.25AK8025
Your Part Number
Technical Datasheet
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| Quantity | Price |
|---|---|
| 1+ | $448.270 |
| 5+ | $441.600 |
| 10+ | $435.140 |
| 25+ | $409.040 |
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F3G32D8DV-023 WT:B
Newark Part No.25AK8025
Technical Datasheet
DRAM TypeLPDDR5
DRAM Density96Gbit
Memory Density96Gbit
Memory Configuration3G x 32bit
DRAM Memory Configuration3G x 32bit
Clock Frequency-
Clock Frequency Max4.266GHz
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins315Pins
Supply Voltage Nom-
Access Time-
IC MountingSurface Mount
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT62F3G32D8DV-023 WT:B is a mobile LPDDR5/LPDDR5X SDRAM.
- Architecture: 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
- Data interface: single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/CK-c) for high-speed operation, differential data clocks
- 16n-bit or 32n-bit prefetch architecture
- Bank architecture: 8-bank (8B) mode, bank group (BG) mode, and 16-bank (16B) mode supported
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- 12GB (96Gb) total density, 8533Mb/s data rate per pin
- 315-ball LFBGA package, -25°C ≤ Tc ≤ +85°C operating temperature
Technical Specifications
DRAM Type
LPDDR5
Memory Density
96Gbit
DRAM Memory Configuration
3G x 32bit
Clock Frequency Max
4.266GHz
Memory Case Style
FBGA
Supply Voltage Nom
-
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
96Gbit
Memory Configuration
3G x 32bit
Clock Frequency
-
IC Case / Package
FBGA
No. of Pins
315Pins
Access Time
-
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate