Print Page
MT62F2G32D4DS-023 WT:B
DRAM, LPDDR5, 64 Gbit, 2G x 32bit, 4.266 GHz, FBGA, 315 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT62F2G32D4DS-023 WT:B
Newark Part No.25AK8011
Your Part Number
Technical Datasheet
78 In Stock
Need more?
Same day shipping
Order before 9pm EST standard shipping
| Quantity | Price |
|---|---|
| 1+ | $269.320 |
| 5+ | $265.070 |
| 10+ | $260.950 |
| 25+ | $256.660 |
Price for:Each
Minimum: 1
Multiple: 1
$269.32
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F2G32D4DS-023 WT:B
Newark Part No.25AK8011
Technical Datasheet
DRAM TypeLPDDR5
DRAM Density64Gbit
Memory Density64Gbit
Memory Configuration2G x 32bit
DRAM Memory Configuration2G x 32bit
Clock Frequency Max4.266GHz
Clock Frequency-
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins315Pins
Supply Voltage Nom1.8V
Access Time-
IC MountingSurface Mount
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT62F2G32D4DS-023 WT:B is a mobile LPDDR5 SDRAM.
- Architecture: 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
- Data interface: single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/CK-c) for high-speed operation, differential data clocks
- 16n-bit or 32n-bit prefetch architecture
- Bank architecture: 8-bank (8B) mode, bank group (BG) mode, and 16-bank (16B) mode supported
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- 8GB (64Gb) total density, 8533Mb/s data rate per pin
- 315-ball TFBGA package, -25°C ≤ Tc ≤ +85°C operating temperature
Technical Specifications
DRAM Type
LPDDR5
Memory Density
64Gbit
DRAM Memory Configuration
2G x 32bit
Clock Frequency
-
Memory Case Style
FBGA
Supply Voltage Nom
1.8V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
64Gbit
Memory Configuration
2G x 32bit
Clock Frequency Max
4.266GHz
IC Case / Package
FBGA
No. of Pins
315Pins
Access Time
-
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate