4900P-250G

4900P-250G is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces. 4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3mm.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B, excellent wettability
• Repeatable and consistent printing characteristics
• Long stencil and tack life facilitate high speed printing
• Suitable for air or nitrogen atmospheres, medium-soft, non-cracking residues
• ROL0 flux classification, rosin flux type, low flux activity
• Corrosion test, electromigration, solder ball test
• 5.5% post reflow flux residue
• 88.5% metal loading