ARRAYJ-30035-16P-PCB

ON Semiconductor’s range of J−Series SiPM sensors have been used to create high fill−factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry−leading fill factor of up to 90%. The ArrayJ products with connectors can be used to interface with the user’s own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB).

• Each SiPM sensor in the array has three electrical connections: fast output, standard output and common
• The substrates (cathodes) of all sensors are summed together to form the common I/O
• Each individual fast output and standard I/O (anode) are routed to its own output pin