63-0000-0959

The 63-0000-0959 is a no-clean liquid Flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. It was developed to minimize the formation of micro-solder balls during wave soldering operations. This flux contains a small percentage of rosin (1%), which improves solder ability, heat stability and surface insulation resistance. It offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. It leaves evenly distributed residues for the best cosmetic appearance. It is in the form of light yellow liquid with alcohol-like odor.

• Extremely shiny joints
• No streaky, white residues
• Improves soldering performance
• Eliminates the need and expense of cleaning
• 82°C Boiling point
• ≤21°C Flash point

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