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The RADSOK RADSERT series Power-to-board Connector facilitates the distribution of power with higher amperage, while allowing the design engineer to achieve size and weight reductions. Conventional interconnects are limited in their ability to deliver high current without consuming excessive board surface area. The RADSOK® Power to Board series of connectors incorporates a hyperbolic lamella socket contact construction that provides more contact surface area. The high performance contact enables higher current carrying capabilities with lower temperature rises than traditional contact systems. Amphenol's RADSOK® power to board product line offers many options for delivering high current and single-point connections to the PCB. RADSERT's compact footprint design can deliver up to 120A of current to the board. The high current density and small surface area connection provides flexibility of board design. RADSERT™ contacts are available in either press-fit or solder termination.

• Hyperbolic socket design ensures many points of contact
• Solder version or pre-loaded RADSERTs are installed during board fabrication
• RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A) 4.8mm (100A) and 6.0mm (120A)
• No special crimp tools required
• No threaded fasteners
• Eliminates risk of PTH cracking or delamination in board
• Faster through-put
• Available in super twist (ST)