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170 In Stock
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Hazardous Item: There maybe additional transit time on this item. Shipping of other items on your order will be unaffected.
Non-Cancellable / Non-Returnable
| Quantity | Price |
|---|---|
| 1+ | $46.150 |
| 10+ | $42.460 |
| 25+ | $41.540 |
| 50+ | $40.610 |
| 100+ | $39.700 |
Price for:Each
Minimum: 1
Multiple: 1
$46.15
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Overview
The 4949G is a 0.875oz Thermal Bond Compound, created using a two part epoxy resin system. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, thermal bond is exceptionally resistant to environmental hazards.
- 169°C Boiling point
- 20.01lbs/gal Density
- Vapor density is heavier than air
Applications
Industrial
Technical Specifications
Adhesive Type
Epoxy
Thermal Conductivity
1.34W/m.K
Dispensing Method
Packet
Weight
25g
SVHC
No SVHC (15-Jan-2019)
Adhesive Colour
Black
Tensile Strength
9200psi
Volume
-
Product Range
-
Associated Products
1 Product Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (15-Jan-2019)
Download Product Compliance Certificate
Product Compliance Certificate
UN Hazard Code:HAZ