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ManufacturerMICRON
Manufacturer Part NoMT47H128M16RT-25E:C
Newark Part No.80AH8120
Your Part Number
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 12 week(s)
| Quantity | Price |
|---|---|
| 500+ | $12.490 |
Price for:Each
Minimum: 1260
Multiple: 1260
$15,737.40
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT47H128M16RT-25E:C
Newark Part No.80AH8120
Technical Datasheet
DRAM TypeDDR2
DRAM Density2Gbit
Memory Density2Gbit
Memory Configuration128M x 16bit
DRAM Memory Configuration128M x 16bit
Clock Frequency400MHz
Clock Frequency Max400MHz
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins84Pins
Supply Voltage Nom1.8V
Access Time2.5ns
IC MountingSurface Mount
Operating Temperature Min0°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT47H128M16RT-25E:C is a DDR2 SDRAM. It uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O balls. A single READ or WRITE operation for the DDR2 SDRAM consists of a single 4n-bitwide, two-clock-cycle data transfer at the internal DRAM core and four corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O balls.
- Operating voltage range is –1.0V to 2.3V(VDD)
- 128Meg x 16 configuration, 8 internal banks for concurrent operation
- Packaging style is 84-ball 9.0mm x 12.5mm FBGA
- Timing (cycle time) is 2.5ns at CL = 5 (DDR2-800)
- Operating temperature range is 0°C to +85°C
- Data rate is 800MT/s, differential data strobe (DQS, DQS#) option
- DLL to align DQ and DQS transitions with CK, duplicate output strobe (RDQS) option for x8
- Programmable CAS latency (CL), posted CAS additive latency (AL)
- On-die termination (ODT), supports JEDEC clock jitter specification
- JEDEC-standard 1.8V I/O (SSTL_18-compatible), 8D response time
Technical Specifications
DRAM Type
DDR2
Memory Density
2Gbit
DRAM Memory Configuration
128M x 16bit
Clock Frequency Max
400MHz
Memory Case Style
FBGA
Supply Voltage Nom
1.8V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
MSL
MSL 3 - 168 hours
DRAM Density
2Gbit
Memory Configuration
128M x 16bit
Clock Frequency
400MHz
IC Case / Package
FBGA
No. of Pins
84Pins
Access Time
2.5ns
Operating Temperature Min
0°C
Product Range
-
SVHC
No SVHC (17-Jan-2023)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate