FEMC008GSTE9-T13-27

Flash Memory, MLC NAND, 8 GB, 8G x 8bit, eMMC 5.1, FBGA, 100 Pins

Image is for illustrative purposes only. Please refer to product description.
FLEXXON FEMC008GSTE9-T13-27
FLEXXON FEMC008GSTE9-T13-27
FLEXXON FEMC008GSTE9-T13-27
ManufacturerFLEXXON
Manufacturer Part NoFEMC008GSTE9-T13-27
Newark Part No.97AK3888
Technical Datasheet
See all Technical Docs
15 In Stock

Need more?

4 Delivery in 1-3 Business Days(US stock)
11 Delivery in 2-4 Business Days(UK stock)
Order before 9pm EST Standard Shipping
QuantityPrice
1+$31.410
5+$29.800
10+$28.170
25+$26.510
50+$24.730
100+$24.190
250+$23.410
Price for:Each
Minimum: 1
Multiple: 1
$31.41
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
This number will be added to the Order Confirmation, Invoice, Dispatch note, Web confirmation Email and Product Label.

Product Information

ManufacturerFLEXXON
Manufacturer Part NoFEMC008GSTE9-T13-27
Newark Part No.97AK3888
Technical Datasheet
Flash Memory TypeMLC NAND
Memory Density8GB
Memory Configuration8G x 8bit
InterfaceseMMC 5.1
IC Case / PackageFBGA
No. of Pins100Pins
Clock Frequency Max200MHz
Access Time-
Supply Voltage Min2.7V
Supply Voltage Max3.6V
Supply Voltage Nom3.3V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range3.3V eMMC NAND Flash Memories
SVHCTo Be Advised

Product Overview

FEMC008GSTE9-T13-27 is a XTRA III series pSLC, industrial eMMC 5.1 flash memory. It fully complies with the JEDEC eMMC5.1 standard. It is a combination of an embedded flash controller and standard MLC NAND flash memory in one JEDEC standard package. It provides high performance, good reliability, and advanced power management. It is suitable for small, low-power electronic devices.

  • 8GB capacity, VCCQ: 1.8V/3.3V, VCC: 3.3V power system
  • Compliant with eMMC specification Ver. 4.3, 4.4, 4.41, 4.5, 4.51, 5.0, 5.1
  • High-speed eMMC protocol, clock frequency range from 0 to 200MHz
  • Supports three data bus widths: 1 bit (default), 4bits, 8bits
  • Supports high speed mode HS400, supports production state awareness
  • Supports field firmware update
  • Supply voltage (NAND) range from 2.7 to 3.6V, 1.125V/ns min slew rate (with respect to VIH/VIL)
  • Clock rise time is 3ns max (CL ≤30pF), clock fall time is 3ns max (CL ≤30pF)
  • Output delay time during data transfer is 13.7ns max (CL ≤30 pF)
  • 100-ball FBGA package, operation temperature range from -40°C to 85°C

Technical Specifications

Flash Memory Type

MLC NAND

Memory Configuration

8G x 8bit

IC Case / Package

FBGA

Clock Frequency Max

200MHz

Supply Voltage Min

2.7V

Supply Voltage Nom

3.3V

Operating Temperature Min

-40°C

Product Range

3.3V eMMC NAND Flash Memories

Memory Density

8GB

Interfaces

eMMC 5.1

No. of Pins

100Pins

Access Time

-

Supply Voltage Max

3.6V

IC Mounting

Surface Mount

Operating Temperature Max

85°C

SVHC

To Be Advised

Technical Docs (1)

Legislation and Environmental

US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes

RoHS

RoHS Phthalates Compliant:Yes

RoHS

SVHC:To Be Advised
Download Product Compliance Certificate

Product Compliance Certificate