63-0020-0959

The 63-0020-0959 is a no-clean non-corrosive Liquid Flux designed for the wave soldering of conventional and surface mount circuit board assemblies. 959T was developed to minimize the formation of micro-solder balls during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solder-ability, heat stability and surface insulation resistance. It offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. It is a very good flux that can be used for secondary soldering such as touch up and repair. 959T leaves evenly distributed residues for the best cosmetic appearance.

• Minimize micro-solder balls
• Extremely shiny joints
• No streaky, white residue
• Improves soldering performance
• Eliminates the need and expense of cleaning
• Classified as ORL0 per J-STD-004

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