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WAKEFIELD SOLUTIONS  623K  Heat Sink, Square, PCB, For Metal Cased Semiconductors, TO-3, 3.47 °C/W, 11.7 mm, 120.6 mm

WAKEFIELD SOLUTIONS 623K
Technical Data Sheet (346.21KB) EN See all Technical Docs

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Product Overview

The 623K is a Heat Sink made of aluminum with black anodized finish. This extruded low-profile heat sink offers stud mounting. It is a general purpose yet efficient heat dissipater for TO-3 and virtually all other styles of metal case power semiconductor package types, the 623 series low-profile flat back heat sink finds a wide variety of applications. The central channel between fins measures 1.3-inch minimum in width. Mounting hole pattern "A" is predrilled for the standard TO-3 package.

 

Product Information

Packages Cooled:
TO-3
Thermal Resistance:
3.47°C/W
External Height - Metric:
11.7mm
External Width - Metric:
120.6mm
External Length - Metric:
120.6mm
External Diameter - Metric:
-
Heat Sink Material:
Aluminium
External Height - Imperial:
0.461"
External Width - Imperial:
4.748"
External Length - Imperial:
4.748"
External Diameter - Imperial:
-
Product Range:
-
SVHC:
No SVHC (17-Dec-2015)

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