Low

WAKEFIELD SOLUTIONS  155  Adhesive, Epoxy, Tube, 6 fl.oz (US), 150 Series

WAKEFIELD SOLUTIONS 155

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Product Overview

The 155 is a 6fl-oz Epoxy Adhesive tube formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical insulator. Its strong bond to a wide variety of substrates resists severe temperature cycling. It is in the form of blue viscous liquid mild aromatic odor.
  • 0.836W/mK Thermal conductivity
  • 2 to 2.2 Specific gravity
  • <1mm hg Vapor pressure
  • >100°C Flash point

Applications

Industrial; Maintenance & Repair

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Product Information

Adhesive Type:
Epoxy
Dispensing Method:
Tube
Adhesive Colour:
-
Volume:
6fl.oz (US)
Weight:
-
Product Range:
150 Series
Shelf Life:
365 Days
RoHS Compliant:
Yes
Kit Contents:
3 oz Resin, 3 oz Hardener
For Use With:
Heat Sinks and Semiconductors
Operating Temperature Max:
65 °C
Features:
High Heat Transfer, Low Shrinkage
SVHC:
No SVHC (17-Dec-2015)
Adhesive Applications:
Bonding, Thermal Heat Sink

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Legislation and Environmental

Product Traceability
RoHS Compliant:
Yes
UN Hazard Code:
HAZRF

Applications

  • Industrial;
  • Maintenance & Repair

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