FISCHER ELEKTRONIK ICK SMD A 8 SA Heat Sink, For SMD, DIP, SSOP, TSSOP, 87 °C/W, 4.8 mm, 6.3 mm, 8 mm
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- Heatsink especially for SMD packages
- Low size
- Reduced weight
- Effective heat transmission
- Bonding directly on IC package
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- Packages Cooled:
- DIP, SSOP, TSSOP
- Thermal Resistance:
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- Heat Sink Material:
- External Height - Imperial:
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- Product Range:
- To Be Advised
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Find products functionally similar to this one. Select one of the following links, and you will be taken to a product group page that presents all products in this category that share the given attribute.
- External Width - Metric: 6.3mm
- Packages Cooled: DIP, SSOP, TSSOP
- External Length - Imperial: 0.315"
- Heat Sink Material: Aluminium
- External Height - Imperial: 0.189"
- External Width - Imperial: 0.248"
- External Height - Metric: 4.8mm
- External Diameter - Imperial: -
- Thermal Resistance: 87°C/W
- External Diameter - Metric: -