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TECHSPRAY  1978-DP  HEAT SINK COMPOUND, SILICONE FREE, TUBE, 4OZ

TECHSPRAY 1978-DP
Technical Data Sheet (814.96KB) EN See all Technical Docs

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Product Overview

The 1978-DP is a Silicone-free Heat Sink draws heat away when applied to a component. In electronics heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical application, it is used with thermocouple wells, thermistors and calrods or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solder ability and increase solder defects. It is in the form of gray paste.
  • Thermal conductivity 0.92W/mK
  • -40 to 392°F Functional temperature range
  • Non-ozone depletion
  • Avoids solder defects due to silicon contamination
  • Will not separate
  • Will not harden and crack
  • 296°C Flash point
  • >204°C Boiling point

 

Product Information

Dispensing Method:
Tube
Volume:
-
Weight:
4oz
Product Range:
-
RoHS Compliant:
Yes
SVHC:
To Be Advised

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Applications

  • Consumer Electronics;
  • Maintenance & Repair

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Associated Products

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