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TE CONNECTIVITY / AMP  8-215570-0  Wire-To-Board Connector, Micro-MaTch Series, 10 Contacts, Plug, 1.27 mm, IDC / IDT, 2 Rows

TE CONNECTIVITY / AMP 8-215570-0

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Product Overview

The 8-215570-0 is a 10-position vertical shrouded paddle-board Wire-to-Board Pin Header with tin over nickel-plated phosphor bronze contacts and red GF polyester housing. The Micro-MaTch series connector supports through-hole termination method to PC board and Insulation Displacement Crimp (IDC) termination method to wire/cable. The Micro-MaTch connector family, with its contact spacing of 1.27mm, offers a variety of wire-to-board interconnections. The Micro-MaTch contact helps prevent fretting corrosion, the traditional failure mode in tin-plated connections. Relative movements caused by vibrations/thermal expansion between male and female contacts are absorbed by an additional positioning spring in the female part. By preventing movements on the contact spot, a gas tight connection can make the Micro-MaTch contact spring system fretting corrosion resistant.
  • Kink PCB mount retention
  • Polarization mating alignment

Applications

Audio; Wireless

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Product Information

Product Range:
Micro-MaTch Series
No. of Contacts:
10Contacts
Gender:
Plug
Pitch Spacing:
1.27mm
Contact Termination Type:
IDC / IDT
No. of Rows:
2Rows
Contact Plating:
Tin Plated Contacts
Contact Material:
Phosphor Bronze
Contact Termination:
IDC / IDT
Series:
Micro-MaTch
Connector Type:
Wire to Board
SVHC:
To Be Advised

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Applications

  • Audio;
  • Wireless

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