Low

MULTICOMP  MCBB830  Breadboard, Solderless, ABS (Acrylonitrile Butadiene Styrene), 8.5mm, 165mm x 56mm

MULTICOMP MCBB830
Technical Data Sheet (316.32KB) EN See all Technical Docs

Image is for illustrative purposes only. Please refer to product description.

Product Overview

The MCBB830 is a 56 x 165mm solderless ABS Prototyping Board with 2.54mm pitch and 7 to 8mm strip length. This board features 630-tie-point terminal strip, 200 distribution strip and accepts 29 to 20AWG wire range.
  • 300V/3 to 5A electrical ratings
  • 1000VAC for one minute Withstanding Voltage
  • 500MΩ/DC500V Insulation resistance

 

Product Information

Board Type:
Breadboard / Solderless
Board Material:
ABS (Acrylonitrile Butadiene Styrene)
Hole Diameter:
-
External Height:
165mm
External Width:
56mm
Board Thickness:
8.5mm
Product Range:
-
Board Connector / Footprint:
-
SVHC:
To Be Advised

Find similar products  grouped by common attribute

Applications

  • Industrial

Legislation and Environmental

Associated Products

Similar Products

Find products functionally similar to this one. Select one of the following links, and you will be taken to a product group page that presents all products in this category that share the given attribute.