LAIRD TECHNOLOGIES KA150-2AC-33X33 THERMALLY CONDUCTIVE CHIP PAD
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- Manufacturer: LAIRD TECHNOLOGIES
- Newark Part No.: 24M3183
- Manufacturer Part No KA150-2AC-33X33
- Eliminates mechanical clamping to heatsinks
- Cut-to-shape 300mm x 300mm sheets
- Heat curable, adhesive coated on both sides
- 0.49°C/W thermal resistance (T0-3)
- Electrically conductive aluminium foil base
- -20°C to +155°C operating temperature
- Thickness 0.14mm
- UL recognised
Product Specifications, Documents & More
- Conductive Material: -
- External Length: 300mm
- External Width: 300mm
- SVHC: To Be Advised
- Thermal Conductivity: -
- Thermal Impedance: 0.49°C/W
- Thickness: 0.16mm
- Volume Resistivity: -
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