LAIRD TECHNOLOGIES KA150-2AC-33X33 THERMALLY CONDUCTIVE CHIP PAD
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- Manufacturer: LAIRD TECHNOLOGIES
- Newark Part No.: 24M3183
- Manufacturer Part No KA150-2AC-33X33
- Eliminates mechanical clamping to heatsinks
- Cut-to-shape 300mm x 300mm sheets
- Heat curable, adhesive coated on both sides
- 0.49°C/W thermal resistance (T0-3)
- Electrically conductive aluminium foil base
- -20°C to +155°C operating temperature
- Thickness 0.14mm
- UL recognised
- Thickness 0.16mm
- Conductive Material -
- Thermal Conductivity -
- SVHC To Be Advised
- Thermal Impedance 0.49°C/W
- Volume Resistivity -
- External Length 300mm
- External Width 300mm
- Product Range -
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