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KA150-2AC-33X33 - 

THERMALLY CONDUCTIVE CHIP PAD

KA150-2AC-33X33 - THERMALLY CONDUCTIVE CHIP PAD

The actual product may differ from image shown

Manufacturer Part No:
KA150-2AC-33X33
Newark Part No.:
24M3183
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
0.16mm
:
-
:
-
:
0.49°C/W
:
-
:
300mm
:
300mm
:
-
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Product Overview

  • Eliminates mechanical clamping to heatsinks
  • Cut-to-shape 300mm x 300mm sheets
  • Heat curable, adhesive coated on both sides
  • 0.49°C/W thermal resistance (T0-3)
  • Electrically conductive aluminium foil base
  • -20°C to +155°C operating temperature
  • Thickness 0.14mm
  • UL recognised

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US continental orders over $49 and under 50 pounds may qualify for free ground shipping. Click the link for the full Terms and Conditions of the offer.

No Longer Manufactured

No longer stocked:: No Longer Manufactured:: true

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Details: 
LAIRD TECHNOLOGIES - KA150-2AC-30X30 - THERMALLY CONDUCTIVE CHIP PAD
1 year, 9 months ago
by
BJN2013
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Answers

A: 
Kool-Pads KA150-2AC material can be used for mounting heat sinks onto devices such as microprocessors, small electronic packages and other components, which require heat sinks. It can be used along with Thermo Electric module to fit Heat sink.
1 year, 9 months ago
by
TechGTC
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