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LAIRD TECHNOLOGIES  KA150-2AC-33X33  THERMALLY CONDUCTIVE CHIP PAD

LAIRD TECHNOLOGIES KA150-2AC-33X33
Technical Data Sheet (159.33KB) EN See all Technical Docs

Image is for illustrative purposes only. Please refer to product description.

Product Overview

  • Eliminates mechanical clamping to heatsinks
  • Cut-to-shape 300mm x 300mm sheets
  • Heat curable, adhesive coated on both sides
  • 0.49°C/W thermal resistance (T0-3)
  • Electrically conductive aluminium foil base
  • -20°C to +155°C operating temperature
  • Thickness 0.14mm
  • UL recognised

 

Product Information

Thickness:
0.16mm
Conductive Material:
-
Thermal Conductivity:
-
Thermal Impedance:
0.49°C/W
Volume Resistivity:
-
External Length:
300mm
External Width:
300mm
Product Range:
-
SVHC:
To Be Advised

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