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LAIRD TECHNOLOGIES  KA150-2AC-33X33  THERMALLY CONDUCTIVE CHIP PAD

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Product Information


  • Conductive Material: -
  • External Length: 300mm
  • External Width: 300mm
  • SVHC: To Be Advised
  • Thermal Conductivity: -
  • Thermal Impedance: 0.49°C/W
  • Thickness: 0.16mm
  • Volume Resistivity: -

Features:

  • Eliminates mechanical clamping to heatsinks
  • Cut-to-shape 300mm x 300mm sheets
  • Heat curable, adhesive coated on both sides
  • 0.49°C/W thermal resistance (T0-3)
  • Electrically conductive aluminium foil base
  • -20°C to +155°C operating temperature
  • Thickness 0.14mm
  • UL recognised

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