Low

LAIRD TECHNOLOGIES  KA150-2AC-33X33  THERMALLY CONDUCTIVE CHIP PAD

LAIRD TECHNOLOGIES KA150-2AC-33X33

Image is for illustrative purposes only. Please refer to product description.

Product Overview

  • Eliminates mechanical clamping to heatsinks
  • Cut-to-shape 300mm x 300mm sheets
  • Heat curable, adhesive coated on both sides
  • 0.49°C/W thermal resistance (T0-3)
  • Electrically conductive aluminium foil base
  • -20°C to +155°C operating temperature
  • Thickness 0.14mm
  • UL recognised

Customers Also bought

Product Information

Thickness:
0.16mm
Conductive Material:
-
Thermal Conductivity:
-
SVHC:
To Be Advised
Thermal Impedance:
0.49°C/W
Volume Resistivity:
-
External Length:
300mm
External Width:
300mm
Product Range:
-

Find similar products  grouped by common attribute

Legislation and Environmental

Similar Products

Find products functionally similar to this one. Select one of the following links, and you will be taken to a product group page that presents all products in this category that share the given attribute.

Recently Viewed

Product Recommendations