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KA150-2AC-33X33 - 

THERMALLY CONDUCTIVE CHIP PAD

LAIRD TECHNOLOGIES KA150-2AC-33X33

The actual product may differ from image shown

Manufacturer Part No:
KA150-2AC-33X33
Newark Part No.:
24M3183
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
-
:
300mm
:
0.49°C/W
:
0.16mm
:
-
:
-
:
300mm
:
-
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Product Overview

  • Eliminates mechanical clamping to heatsinks
  • Cut-to-shape 300mm x 300mm sheets
  • Heat curable, adhesive coated on both sides
  • 0.49°C/W thermal resistance (T0-3)
  • Electrically conductive aluminium foil base
  • -20°C to +155°C operating temperature
  • Thickness 0.14mm
  • UL recognised