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60-1-10 - 

Desoldering Braid, Soder-Wick®, No-Clean, #1 Blue, Static Dissipative Bobbin, 10 ft x 0.03"

CHEMTRONICS 60-1-10
CHEMTRONICS 60-1-10

The actual product may differ from image shown

Manufacturer Part No:
60-1-10
Newark Part No.:
95F6251
Technical Datasheet:
(EN)
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Product Information

:
10ft
:
Oxygen Free Copper
:
0.8mm
:
-
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Product Overview

The 60-1-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
  • White label on SD bobbin
  • Minimizes the risk of damage associated with static electricity
  • Patented non-corrosive, halide-free and organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Requires little or no post solder cleaning
  • No corrosive residues
  • Minimal risk of heat and static component damage
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
  • Packaged in ESD-safe static dissipative bobbins

Applications

Maintenance & Repair

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