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GC ELECTRONICS  10-8118  Sealant, Heat Sink Compound, Type 44, Electronics, Jar, White, 0.5fl.oz (US)

GC ELECTRONICS 10-8118
Technical Data Sheet (27.57KB) EN See all Technical Docs

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Product Overview

The Type 44 Non-Silicone series Heat Sink Compound is a non-silicone based, grease-like material specially blended with thermally conductive fine metal oxide powders. Compounded from 100% synthetic base stocks, it is designed as an alternative to silicone type heat sink compounds. This material features outstanding heat transfer efficiency, viscosity, high dielectric strength and thermal stability. Commonly used at the junction between a heat producing electrical device and the cooling medium, type 44 heat sink compound facilitates the transfer and removal of the damaging heat. The compound clings to all metal surfaces and will not melt, bleed or harden over time. This product can be used anywhere a silicone heat sink is used without the fear of silicone fluid migration.
  • 260°C Dropping point
  • -30 to 200°C Temperature range

 

Product Information

Sealant Type:
-
Sealant Applications:
Electronics
Dispensing Method:
Jar
Sealant Color:
White
Volume:
0.5fl.oz (US)
Weight:
-
Product Range:
Type 44 Non-Silicone
RoHS Compliant:
Yes
Colour:
White
SVHC:
To Be Advised

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Applications

  • Industrial

Legislation and Environmental

RoHS Compliant:
Yes
Authorized Distributor

Substitutes

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