AAVID THERMALLOY 374124B00032G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm
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- Tape mounting saves board space by eliminating mounting holes
- Convenient peel and stick assembly is quick and clean
- Pin-Fin array allows omni-directional airflow to maximize heat dissipation
- Fin dimensions (LxW): 6x6mm
- Packages Cooled:
- Thermal Resistance:
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- Heat Sink Material:
- External Height - Imperial:
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- Product Range:
- To Be Advised
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- External Width - Metric: 23mm
- Packages Cooled: BGA
- External Length - Imperial: 0.906"
- Heat Sink Material: Aluminium
- External Height - Imperial: 0.709"
- External Width - Imperial: 0.906"
- External Height - Metric: 18mm
- External Diameter - Imperial: -
- Thermal Resistance: 23.4°C/W
- External Diameter - Metric: -