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60-2-10 - 

Desoldering Braid, Soder-Wick®, No-Clean, #2 Yellow, Static Dissipative Bobbin, 10ft x 0.06"

CHEMTRONICS 60-2-10

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Manufacturer Part No:
60-2-10
Newark Part No.:
95F6252
Technical Datasheet:
(EN)
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Product Information

:
10ft
:
Oxygen Free Copper
:
1.52mm
:
-
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Product Overview

The 60-2-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
  • Soder-Wick® No-Clean packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricty
  • Patented non-corrosive, halide-free organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
  • No corrosive residues
  • Minimal risk of heat and static component damage
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
  • Packaged in ESD-safe static dissipative bobbins

Applications

Maintenance & Repair

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