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BP100-0.005-00-12/12 - 

Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

BP100-0.005-00-12/12 - Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

The actual product may differ from image shown

Manufacturer:
BERGQUIST BERGQUIST
Manufacturer Part No:
BP100-0.005-00-12/12
Newark Part No.:
18K5357
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
0.8W/m.K
:
-
:
0.005"
:
-
:
-
:
-
:
300mm
:
-
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Product Overview

  • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
  • Thermal impedance: 0.86℃ - in²/W (@ 100 psi)
  • High bond strength to a variety of surfaces
  • Double-sided pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting

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US continental orders over $49 and under 50 pounds may qualify for free ground shipping. Click the link for the full Terms and Conditions of the offer.

115 In stock

UK Stock

Freight Charge: $20.00 once per order

Delivery in 5-7 business days from our UK warehouse for in stock items

 
Check stock and lead times
More stock available week commencing 2/26/18
$33.58 $ 33.58
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No longer stocked:: No Longer Manufactured::
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