Low

BERGQUIST  BP100-0.005-00-12/12  Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

BERGQUIST BP100-0.005-00-12/12
Manufacturer:
BERGQUIST BERGQUIST
Manufacturer Part No:
BP100-0.005-00-12/12
Newark Part No.:
18K5357
Technical Datasheet:
See all Technical Docs

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Product Overview

  • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
  • Thermal impedance: 0.86℃ - in²/W (@ 100 psi)
  • High bond strength to a variety of surfaces
  • Double-sided pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting

 

Product Information

Thermal Conductivity:
0.8W/m.K
Conductive Material:
-
Thickness:
0.005"
Thermal Impedance:
-
Dielectric Strength:
-
External Length:
-
External Width:
300mm
Product Range:
-
SVHC:
To Be Advised

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Legislation and Environmental

RoHS Compliant:
Yes
Independent Distributor

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