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AS5-3.5G - 

Sealant, Heat Sink Compound, Electronics, Syringe, Silver, 3.5g

AS5-3.5G - Sealant, Heat Sink Compound, Electronics, Syringe, Silver, 3.5g
AS5-3.5G - Sealant, Heat Sink Compound, Electronics, Syringe, Silver, 3.5g

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Manufacturer Part No:
AS5-3.5G
Newark Part No.:
25M6617

Product Information

:
-
:
Electronics
:
Syringe
:
Silver
:
-
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3.5g
:
-
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Product Overview

The AS5-3.5G is a high-density Polysynthetic Thermal Compound that provides a new level of performance and stability with its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles. It is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions. It uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It contains over 88% thermally conductive filler by weight and contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability. It does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the syringe, its consistency is engineered for easy application.
  • Controlled triple-phase viscosity
  • Not electrically conductive
  • Absolute stability
  • 0.49-micron average particle size
  • -50 to >180°C peak temperature
  • 3 to 12°C lower CPU full load core temperature

Applications

Industrial

Warnings

Not recommended on the older slot type Intel Xeon processors with large multiple square inch CPU to heatsink interfaces.

Substitutes

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WAKEFIELD SOLUTIONS

Thermal Grease / Compound, Syringe, 4 oz

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WAKEFIELD SOLUTIONS

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3 years, 7 months ago
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Anonymous
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Answers

A: 
It is not used for glue purpose but it is enhanced thermally conductive ceramic particles.It helps in faster transfer of heat to the heatsink.
3 years, 7 months ago
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TechGTC
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