4949G - 

Adhesive, Thermal, Epoxy, Black, Packet

4949G - Adhesive, Thermal, Epoxy, Black, Packet

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Product Overview

The 4949G is a 0.875oz Thermal Bond Compound, created using a two part epoxy resin system. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, thermal bond is exceptionally resistant to environmental hazards.
  • 169°C Boiling point
  • 20.01lbs/gal Density
  • Vapor density is heavier than air



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US continental orders over $49 and under 50 pounds may qualify for free ground shipping. Click the link for the full Terms and Conditions of the offer.

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More stock available week commencing 9/17/18

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$48.49 $ 48.49
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