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375024B00032G - 

Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 12.2 °C/W, 18 mm, 40 mm, 40 mm

375024B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 12.2 °C/W, 18 mm, 40 mm, 40 mm

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Manufacturer Part No:
375024B00032G
Newark Part No.:
05M6208
Technical Datasheet:
(EN)
See all Technical Docs

Product Information

:
BGA
:
12.2°C/W
:
18mm
:
40mm
:
40mm
:
-
:
Aluminium
:
0.709"
:
1.575"
:
1.575"
:
-
:
-
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Product Overview

The 375024B00032G is a white pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
  • Tape mounting saves board space by eliminating mounting holes
  • Convenient peel and stick assembly is quick and clean
  • Pin-fin array allows omnidirectional airflow to maximize heat dissipation
  • Comes with T405R Chomerics tape for metal surfaces
  • Acrylic adhesive

Applications

HVAC, Thermal Management

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